Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration
M.L. Huang1 
, Z.J. Zhang1 , H.T. Ma1 , L.D. Chen2
, Z.J. Zhang
Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration |
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M.L. Huang
, Z.J. Zhang |
| Fig. 3 SEM images of CuSnNi interconnects after L-S interfacial reaction at 250 #cod#x000b0;C without electron current for various times: a and b 10 min; c and d 1 h; e and f 2 h; g and h 4 h. |
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