Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration
M.L. Huang1 
, Z.J. Zhang1 , H.T. Ma1 , L.D. Chen2
, Z.J. Zhang
Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration |
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M.L. Huang
, Z.J. Zhang |
| Fig. 2 Microstructure of as-soldered CuSnNi interconnect: a macrograph; b NiSn interface and c SnCu interface. |
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