Characterization, Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass
Chen Haiyan1, Cao Jian1,*, Song Xiaoguo2, Liu Jiakun1, Feng Jicai1,2
Fig. 9. MF-XRD patterns of the interface of BMG joints bonded by IADB under 120 MPa for different time: a 10 min, b 15 min, c 20 min, d 25 min, e 30 min.