Characterization, Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass
Chen Haiyan1, Cao Jian1,*, Song Xiaoguo2, Liu Jiakun1, Feng Jicai1,2
Fig. 7. Backscattered electron images of the joints bonded by IADB for 20 min under different pressures: a 40 MPa, b 80 MPa, c 120 MPa, d 160 MPa.