Characterization, Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass
Chen Haiyan1, Cao Jian1,*, Song Xiaoguo2, Liu Jiakun1, Feng Jicai1,2
Fig. 6. Backscattered electron images of the joints bonded by IADB under 120 MPa for different time: a 5 min, b 10 min, c 15 min, d 20 min, e 25 min, f 30 min.