Characterization, Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass
Chen Haiyan1, Cao Jian1,*, Song Xiaoguo2, Liu Jiakun1, Feng Jicai1,2
Fig. 13. C-scan images of interface layers of joints bonded by different methods under 120 MPa for 15 min and 20 min, respectively: a and b conventional diffusion bonding, c and d IADB, e and f FADB.