Characterization, Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass
Chen Haiyan1, Cao Jian1,*, Song Xiaoguo2, Liu Jiakun1, Feng Jicai1,2
Fig. 10. TEM bright field images and their corresponding SAED patterns of specimens taken from the interface of joints bonded by IADB under 120 MPa for different time: a 10 min, b 15 min, c 20 min, d 25 min.