[1] P.P.Conway, M.R.Kalantary and D.J.Williams: ASME J. Electro. Packaging, 1996, 118(4), 223. [2] Y.X.Gao, H.Fan and Z.Xiao: Acta Mater, 2000, 48, 863. [3] S.M.Heinrich and P.S.Lee: Adv. Electro. Packaging, 1997, 19(2), 1371. [4] K.A.Brake: Surf. Evolver Manual, Version 2, 10, Susque-hanna University Press, USA, 1998, 2, 10. [5] G.Z.Wang, Z.N.Chen and C.Q.Wang: Modeling and Simulation in Mater. Sci. Eng., 1998, (6), 557. [6] D.Wheeler and C.Bailey: IEEE Inter. Soc. Conf. on Thermal Phenomena, Hawaii, USA, 2000, 79. [7] F.P.Renken and G.Subbarayan: Computer Methods in Applied Mechanics and Engineering, 2000, (190), 1391. [8] X.J.Zhao and C.Q.Wang: IEEE Transaction on Electronics Packaging Manufacturing, 2000, 23(2), 87. [9] K.N.Chiang and C.A.Yuan: IEEE Transaction or Advanced Packaging, 2001, 24(2), 158. [10] H.Lu, G.Glinski and C.Bailey: APACK 2001 Conf. on Advances in Packaging, Suntec, Singapore, 2001, 245. [11] T.Nagata and T.Kobayashi: Proceedings of IPACK'01, Hawaii, USA, 2001, 1. [12] B.H.Yeung and T.T.Lee: IEEE Electronic Components and Technology Conf., Orlando, USA, 2001, 1000. [13] M.Park, C.Lee and J.Hong: J. Korean Phys. Soc., 2002, 40(6), 992. [14] B.G.Sidharth, R.Blish and D.Natekar: IEEE Electronic Components and Technology Conf., San Diego, USA, 2002, 1739. [15] B.H.Yeung and T.T.Lee: IEEE Transactions on Electron-ics Packaging Manufacturing, 2003, 26(1), 68. [16] M.Y.Li, C.Q.Wang and L.Zhang: Progress in Natural Sci., 2001, 11(3), 221. |