J Mater Sci Technol ›› 2004, Vol. 20 ›› Issue (Supl.): 78-80.

• Research Articles • Previous Articles     Next Articles

Residual Stress and Microscratch Resistance of Au/NiCr/Ta Multilayered Films

Wu TANG, Kewei XU   

  1. LASMIS, Université de Technologie de Troyes, 10010 Troyes Cedex, France...
  • Received:1900-01-01 Revised:1900-01-01 Online:2004-12-28 Published:2009-10-10
  • Contact: Wu TANG

Abstract: Au/NiCr/Ta multilayered metallic films deposited on Al2O3 substrate by magnetron sputtering have been used in microwave integrated circuits (MIC). The residual stress and scratch resistance were investigated at different deposition temperature. The residual stress in as-deposited films was of tension with 155 MPa~400 MPa and changed to compression after samples annealing. It was found that both friction and acoustic emission modes can eventually be used for conventionally critical load determination, the critical characteristic load at each point corresponding to abrupt change of the friction coefficient was not sensitive to deposition temperature, but sensitive to the film thickness. Critical load is less sensitive to the change of residual stress by microscratch method.

Key words: Residual stress, Scratch, Critical load