J Mater Sci Technol ›› 2003, Vol. 19 ›› Issue (Supl.): 80-82.

• Research Articles • Previous Articles     Next Articles

Numerical Simulation of Residual Stress during Microlayer Composite Material Processing by EBPVD Technique

Liping SHI, Yao LI, Xiaodong HE   

  1. Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, China
  • Received:1900-01-01 Revised:1900-01-01 Online:2003-12-28 Published:2009-10-10
  • Contact: Liping SHI

Abstract: The preparation technology of microlayer composite material by the electron beam physical vapor deposition (EBPVD) technique was briefly introduced. Taking the advantage of the large-scale commercial software of finite element analysis, a reasonable physical model was built up during the deposition processing and the distribution of residual stress was analyzed between substrate and deposition layer or among deposition layers. The results show that: with the increasing substrate preheating temperature, the interlaminar shear stress increases but the axial residual stress decreases. The probability of curling up after de-bonding tends to enhance as the thickness of deposition film increases.

Key words: Microlayer composite material, EBPVD, Residual stress, Numerical simulation