Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer

J Mater Sci Technol ›› 2003, Vol. 19 ›› Issue (Supl.): 181-183.

• Research Articles • Previous Articles Next Articles

Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer

Zhuoran LI, Jicai FENG, Jian CAO, Yiyu QIAN

State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

Received:1900-01-01 Revised:1900-01-01 Online:2003-12-28 Published:2009-10-10
Contact: Zhuoran LI

Abstract

Abstract: Vacuum diffusion bonding of TiB2 cermet to TiAl -based alloys using Ni interlayer has been carried out at 1123～1323 K for 0.6～3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and mechanical properties was investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110 MPa with bonding temperature at 1223 K, bonding time for 1.8 ks and bonding pressure under 80 MPa.

Key words: Microstructure, Strength, TiB2, TiAl

Zhuoran LI, Jicai FENG, Jian CAO, Yiyu QIAN. Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer[J]. J Mater Sci Technol, 2003, 19(Supl.): 181-183.

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Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer

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