J Mater Sci Technol ›› 2001, Vol. 17 ›› Issue (S1): 127-130.

• Research Articles • Previous Articles     Next Articles

Fabrication of a W/W-Mo/Mo system layered flier-plate material

Chuanbin WANG, Qing SHEN, Lianmeng ZHANG   

  1. State Key Laboratory of Advanced Technology for Materials and Processing, Wuhan University of Technology, Wuhan 430070, China
  • Received:2000-11-01 Revised:2001-01-02 Online:2001-10-28 Published:2009-10-10
  • Contact: Chuanbin WANG

Abstract: A kind of W/W-Mo/Mo system layered flier-plate material (LFP) was fabricated in this study by the methods of powder metallurgy and bonding together. Such LFP had high parallelism, planeness and densification and its density varied from 17.25x10(3) kg/m(3) to 10.22x10(3) kg/m(3) through a total thickness of 3.0 mm. The W-Mo interlayer of this LFP was obtained by hot-press sintering and its densification at 1573 K was studied. Then by using additives 4Ni-3Cu (in wt pct), the LFP was fabricated under 1573 K-30 MPa-60 min. The mechanism of the interfacial bonding of the W/W-Mo/Mo system LFP was also mainly investigated.

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