Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method

J Mater Sci Technol ›› 2001, Vol. 17 ›› Issue (01): 165-166.

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Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method

Hongyuan FANG, Li WANG, Yiyu QIAN

National Key Laboratory of Advanced Welding Production Technology, Harbin\'Institute of Technology, Harbin 150001, China

Received:2000-04-05 Revised:1900-01-01 Online:2001-01-28 Published:2009-10-10
Contact: Li WANG

Abstract

Abstract: Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) acid crack size (a), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

Key words:

Hongyuan FANG, Li WANG, Yiyu QIAN. Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method[J]. J Mater Sci Technol, 2001, 17(01): 165-166.

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Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method

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