Nanosecond pulsed laser-assisted modified copper surface structure: Enhanced surface microhardness and microbial corrosion resistance

doi:10.1016/j.jmst.2021.08.023

Abstract

Abstract:

Microbiologically influenced corrosion (MIC) is an unavoidable problem in several industries. Copper (Cu) and its alloys are widely used engineering materials. However, MIC of Cu remains a persistent challenge to their performance and functional lifetime under aggressive environments. This study investigated nanosecond pulsed laser processing (LP), which may enhance the corrosion resistance of Cu. The microstructural evolution and corrosion behavior of LP-Cu in the presence of sulfate-reducing bacteria (SRB) were evaluated. Typical deformation-induced microstructural features of high-density dislocations were analyzed on the top surface of LP-Cu coupon. Electrochemical measurements suggested that LP-Cu coupons exhibited better corrosion resistance in SRB-inoculated solution compared with their original counterpart. The enhanced corrosion resistance by LP primarily resulted from the combined influences of compressive residual stress and work hardening in the surface. However, overlap percentage played a key role in improving corrosion resistance. LP produced optimal corrosion resistance at 50% overlap. Therefore, this study introduces a unique and an option for anticorrosion control in manufacturing processes and potentially implements it onto other materials to improve its microbial corrosion resistance through LP.

Key words: Pure copper, Laser processing, Microbiologically influenced corrosion, Pitting, Severe plastic deformation

Boxin Wei, Jin Xu, Liqun Gao, Hui Feng, Jiajun Wu, Cheng Sun, Zhenyao Wang, Wei Ke. Nanosecond pulsed laser-assisted modified copper surface structure: Enhanced surface microhardness and microbial corrosion resistance[J]. J. Mater. Sci. Technol., 2022, 107: 111-123.

Figures/Tables 13

Fig. 1. The LP experimental setup and the schematic diagrams of LP modes with the LP scanning path of 30%, 50% and 70% overlap.

Fig. 2. Surface topographies and profile measurement curves of (a1-a3) Cu, (b1-b3) LP30%-Cu, (c1-c3) LP50%-Cu and (d1-d3) LP70%-Cu.

Fig. 3. (a) Optical images, (b) microhardness and (c) surface roughness and contact angle values of Cu, LP30%-Cu, LP50%-Cu and LP70%-Cu.

Fig. 4. Typical microstructure of top surface of LP50%-Cu coupon: (a, b) typical bright-field TEM images and (c, e) selected area electron diffraction (SAED) pattern of marked region A (fcc [111] direction); (d) HRTEM micrograph of dislocation in [111] orientation. (f) Inverse FFT (IFFT) results of micrograph in (d) and the dislocations are circled.

Fig. 5. Nyquist (a, c, e, g, and i) and Bode (b, d, f, h, and g) plots of Cu, LP30%-Cu, LP50%-Cu and LP70%-Cu coupons after (a, b) 6 h, (c, d) 24 h, (e, f), 48 h, (g, h) 72 h, and (i, j) 96 h.

Fig. 6. (a) Rct values of Cu, LP30%-Cu, LP50%-Cu and LP70%-Cu; (b) comparison of efficiency for overlap percentages of 30%, 50%, and 70%.

Fig. 7. SEM images of corrosion product formed on (a, b) Cu, (c, d) LP30%-Cu, (e, f) LP50%-Cu and (g, h) LP70%-Cu.

Table 1 EDS results of Cu, LP30%-Cu, LP50%-Cu and LP70%-Cu coupons in SRB-inoculated solution (wt.%).

Positions	O	S	Cu
A	03.10	15.30	81.60
B	01.33	11.36	87.31
C	-	05.30	94.70
D	-	17.13	82.87

Fig. 8. XPS findings. (a) Survey spectra and high-resolution spectra for (b, c) Cu 2p and (d, e) S 2p on the surface film of Cu, LP30%-Cu, LP50%-Cu and LP70%-Cu.

Fig. 9. CLSM images of live/dead staining biofilms on the surface of (a, b) Cu, (c, d) LP30%-Cu, (e, f) LP50%-Cu and (g, h) LP70%-Cu after 96 h in SRB-inoculated medium, (i) measured biofilm thickness. (For interpretation of the references to colour in this figure legend, the reader is referred to the web version of this article.)

Fig. 10. SEM images of (a) Cu, (b) LP30%-Cu, (c) LP50%-Cu and (d) LP70%-Cu after 96 h in SRB-containing medium.

Fig. 11. Largest pit morphology of (a) Cu, (b) LP-30% Cu, (c) LP-50% Cu, (d) LP-70% Cu coupons after 96 h in SRB-containing medium. (e) Pits diameter and depth curves and (f) derived data on the four coupon surface.

Fig. 12. Schematic diagram of the corrosion behavior of (a) Cu and (b) LP Cu in SRB-inoculated solution.

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