J. Mater. Sci. Technol. ›› 2022, Vol. 98: 1-13.DOI: 10.1016/j.jmst.2020.12.081

• Research Article •     Next Articles

The precipitation behaviours and strengthening mechanism of a Cu-0.4 wt% Sc alloy

Zifan Haoa, Guoliang Xiea,*(), Xinhua Liub,c,**(), Qing Tana, Rui Wangb   

  1. aState Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China
    bKey Laboratory for Advanced Materials Processing of Ministry of Education, Institute of Advanced Materials and Technology, University of Science andTechnology Beijing, Beijing, 100083, China
    cBeijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing, 100083, Chinaa
  • Received:2020-09-27 Accepted:2020-12-11 Published:2022-01-30 Online:2022-01-25
  • Contact: Guoliang Xie,Xinhua Liu
  • About author:**Corresponding author at: Key Laboratory for Advanced Materials Processing ofMinistry of Education, Institute of Advanced Materials and Technology, Universityof Science and Technology Beijing, Beijing, 100083, China.E-mail addresses: liuxinhua@ustb.edu.cn (X. Liu).
    * leonxq@126.com (G. Xie)

Abstract:

The precipitation behaviours during the aging process and the corresponding strengthening mechanism of a Cu-0.4 wt% Sc alloy were systematically investigated in this study. The phase transformation sequence of the precipitation in the aging process of the Cu-0.4 wt% Sc alloy was found to be: supersaturated solid solution→ Sc-enriched atomic clusters→ metastable phase→Cu4Sc phase. The tetragonal structured lamellar Cu4Sc precipitates, with a habit plane parallel to the {111} plane of the Cu matrix and orientation relationships of $(0 \overline{2}2_{ \alpha})//(211)_{ Cu4Sc }$ and $[011]_{ \alpha}//[11 \overline{3}]_{ Cu4Sc }$, are found homogeneously distributed in the matrix. A combined process of cryogenic rolling (CR) and aging was designed for optimization of the mechanical and electrical properties. Excellent integration of yield strength (696 MPa) and electrical conductivity (62.8 % IACS) of this alloy was achieved by cryogenic rolling and subsequent aging process at 400 °C for 4 h. The significant precipitation strengthening effect of this alloy is attributed to the Cu4Sc precipitates with an extremely small size of only 1.5-3 nm. The leading strengthening mechanism is considered as the superposition of both coherent strengthening and Orowan strengthening effects.

Key words: Cu-Sc alloy, Precipitation, Aging process, Strengthening mechanisma