Orientation dependent behavior of tensile-creep deformation of hot rolled Ti65 titanium alloy sheet

doi:10.1016/j.jmst.2020.10.021

Abstract

Abstract:

The mill products like sheet always have one or more severe textures inevitably, and its effect on mechanical properties is not a negligible issue. The orientation dependent tensile-creep behavior induced by rolling texture of Ti65 titanium alloy sheet has been systematically investigated at 650 ℃. There are some anisotropic characteristics between TD and RD of Ti65 sheet. The UTS and TYS of TD are higher than RD at 650 ℃. Besides, the creep endurance time of TD (172.6-174.5 h) is about three times longer than RD (55.6-65.1 h) at 650 ℃ and 240 MPa. Moreover, the grains are inclined to form Texture Ⅲ ($\bar{1}2\bar{1}6$)[$1\bar{2}11$] and ($01\bar{1}3$)[$1\bar{2}11$] after creep along with TD, but to form Texture Ⅰ ($\bar{1}2\bar{1}0$)[$10\bar{1}0$] after creep along with RD. Finally, the crack initiation site is different during creep in TD and RD. The reason for anisotropic properties of tensile and creep has been summarized in two aspects: (ⅰ) the change of the SFs (Schmid factors) value between TD and RD; (ⅱ) the difference of creep mechanism between TD (grain boundary sliding) and RD (dislocation slip). Anisotropy of Ti65 sheet should be fully considered to increase structural efficiency in the engineering design and application.

Key words: Titanium alloy, Texture, Anisotropy, Tensile, Creep

Zhixin Zhang, Jiangkun Fan, Ruifeng Li, Hongchao Kou, Zhiyong Chen, Qingjiang Wang, Hailong Zhang, Jian Wang, Qi Gao, Jinshan Li. Orientation dependent behavior of tensile-creep deformation of hot rolled Ti65 titanium alloy sheet[J]. J. Mater. Sci. Technol., 2021, 75: 265-275.

Figures/Tables 12

Fig. 1. (a) Schematic drawing of mechanical specimen extraction and (b) three dimensional optical micrographs of the as received Ti65 alloy sheet.

Fig. 2. Microstructure and texture of the as received Ti65 alloy sheet: OIM maps of ND (a) and RD (b), KAM map (c), three dimensional ODF (d), constant φ2 = 0° (e) and φ2 = 30° ODF maps (f), PFs by EBSD (g), PFs by XRD (h).

Fig. 3. Tensile stress-strain and displacement-time curves of Ti65 alloy sheet performed at 650 ℃ along (a) (c) Tensile-T, and (b) (d) Tensile-R. The fracture specimen images are inserted in (a) and (b).

Table 1 Tensile properties of Ti65 alloy sheets at 650 ℃ and ambient temperature.

T (℃)	Specimen direction	UTS (MPa)	DR _UTS (%)	TYS (MPa)	DR _TYS (%)	Fracture strain (%)
650	TD	746	8.3	500	5.0	33.7
650	RD	684	8.3	475	5.0	29.0
20 [32]	TD	1149	4.8	1043	5.8	9.4
20 [32]	RD	1094	4.8	983	5.8	9.3

Fig. 4. OIM maps, 3D ODFs and KAM maps of Ti65 alloy sheet for tensile tests at 650 ℃: (a), (b) (c), (d) Tensile-T, (e), (f), (g), (h) Tensile-R.

Fig. 5. Creep displacement-time curves and fracture specimen images of Ti65 alloy sheet performed at 650 ℃ and 240 MPa: (a) Creep-T1, (b) Creep-T2, (c) Creep-L1 and (d) Creep-L2.

Table 2 Creep properties of Ti65 alloy sheets at 650 ℃ and 240 MPa.

Specimen	Elongation (mm)	DR _Elongation (%)	Endurance time (h)	DR _{Endurance time} (%)
Creep-T1	8.4	112.0	174.5	65.2
Creep-T2	7.4		172.6
Creep-R1	15.5		65.1
Creep-R2	18.0		55.6

Fig. 6. OIM maps, 3D ODFs and KAM maps of Ti65 alloy sheet for creep tests at 650 ℃ and 240 MPa: (a), (b), (c), (d) Creep-T1, (e), (f), (g), (h) Creep-R1.

Fig. 7. SEM images of fracture morphology for (a) Tensile-T, (d) Tensile-R, (b) (c) Creep-T1, and (e) (f) Creep-R1 specimens performed at 650 ℃. The macro fracture appearances are inserted in (a), (b), (d) and (e).

Fig. 8. Normalized steady creep rate vs. applied stress plot of (a) TD and (d) RD. Micrographs of (b), (c) Creep-T1 and (e), (f) Creep-R1 depicting the presence of different creep regimes at 650 ℃.

Fig. 9. Schmid factors (SFs) histogram obtained by EBSD of α phase with Basal <a>, Prismatic <a>, Pyramidal <a> and Pyramidal < c + a >slip systems for as received Ti65 alloy sheet along (a) TD and (b) RD.

Fig. 10. Micro-crack nuclei of Creep-T1 (a, b, c) and Creep-L1 (d, e, f): (a), (d) SEM image, (b), (e) Euler map, (c), (f) KAM map.

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