J. Mater. Sci. Technol. ›› 2021, Vol. 67: 145-155.DOI: 10.1016/j.jmst.2020.06.033
• Research article • Previous Articles Next Articles
Hong Honga,c, Jiyong Hua,b,*(), Kyoung-Sik Moonc, Xiong Yana, Ching-ping Wongc
Received:
2020-05-04
Revised:
2020-06-10
Accepted:
2020-06-14
Published:
2021-03-20
Online:
2021-04-15
Contact:
Jiyong Hu
About author:
* Key Laboratory of Textile Science &Technology, Min-istry of Education, Donghua University, Shanghai 201620, China.E-mail address: hujy@dhu.edu.cn (H. Jiyong).Hong Hong, Jiyong Hu, Kyoung-Sik Moon, Xiong Yan, Ching-ping Wong. Rheological properties and screen printability of UV curable conductive ink for flexible and washable E-textiles[J]. J. Mater. Sci. Technol., 2021, 67: 145-155.
Ingredients (g) | CI-1 | CI-2 | CI-3 | CI-4 |
---|---|---|---|---|
PUA | 1.6 | 2.0 | 2.4 | 2.8 |
TPGDA | 0.94 | 0.74 | 0.54 | 0.34 |
TMPTA | 0.94 | 0.74 | 0.54 | 0.34 |
1173 | 0.4 | 0.4 | 0.4 | 0.4 |
KH-560 | 0.088 | 0.088 | 0.088 | 0.088 |
BYK-333 | 0.012 | 0.012 | 0.012 | 0.012 |
BYK-555 | 0.02 | 0.02 | 0.02 | 0.02 |
Ag nano-flakes | 6.0 | 6.0 | 6.0 | 6.0 |
Table 1 Formulation for UV-curing conductive inks.
Ingredients (g) | CI-1 | CI-2 | CI-3 | CI-4 |
---|---|---|---|---|
PUA | 1.6 | 2.0 | 2.4 | 2.8 |
TPGDA | 0.94 | 0.74 | 0.54 | 0.34 |
TMPTA | 0.94 | 0.74 | 0.54 | 0.34 |
1173 | 0.4 | 0.4 | 0.4 | 0.4 |
KH-560 | 0.088 | 0.088 | 0.088 | 0.088 |
BYK-333 | 0.012 | 0.012 | 0.012 | 0.012 |
BYK-555 | 0.02 | 0.02 | 0.02 | 0.02 |
Ag nano-flakes | 6.0 | 6.0 | 6.0 | 6.0 |
Fig. 2. Schematic diagram of screen printing in a cross-sectional view. a) The conductive ink was placed on the screen and the squeegee moved downward. b) The squeegee scraped the conductive ink and pressed the screen at the same time.
Fig. 3. a) Photograph of the prepared CI-4. b) XRD pattern of nano-silver flakes used for the preparation of UV curable conductive ink. c) Size distribution of nano-silver flakes by intensity.
Fig. 4. a) Viscosity of UV curable conductive inks at shear rates ranging from 0.1 to 1000 s-1. b) Rheological behavior of UV curable conductive inks in simulated printing process.
0.1 s-1 at 20 s | 200 s-1 at 50 s | 0.1 s-1 at 80 s | 0.1 s-1 at 110 s | Recovery at 80 s | Recovery at 110 s | |
---|---|---|---|---|---|---|
CI-1 | 85.52 Pa·s | 2.78 Pa·s | 22.39 Pa·s | 51.80 Pa·s | 26.18 % | 60.57 % |
CI-2 | 117.53 Pa·s | 3.79 Pa·s | 44.26 Pa·s | 81.22 Pa·s | 37.65 % | 69.10 % |
CI-3 | 176.29 Pa·s | 5.57 Pa·s | 83.12 Pa·s | 153.32 Pa·s | 47.14 % | 86.97 % |
CI-4 | 309.49 Pa·s | 8.14 Pa·s | 169.91 Pa·s | 254.94 Pa·s | 54.90 % | 82.37 % |
Table 2 Viscosity of different conductive inks at different shear rates.
0.1 s-1 at 20 s | 200 s-1 at 50 s | 0.1 s-1 at 80 s | 0.1 s-1 at 110 s | Recovery at 80 s | Recovery at 110 s | |
---|---|---|---|---|---|---|
CI-1 | 85.52 Pa·s | 2.78 Pa·s | 22.39 Pa·s | 51.80 Pa·s | 26.18 % | 60.57 % |
CI-2 | 117.53 Pa·s | 3.79 Pa·s | 44.26 Pa·s | 81.22 Pa·s | 37.65 % | 69.10 % |
CI-3 | 176.29 Pa·s | 5.57 Pa·s | 83.12 Pa·s | 153.32 Pa·s | 47.14 % | 86.97 % |
CI-4 | 309.49 Pa·s | 8.14 Pa·s | 169.91 Pa·s | 254.94 Pa·s | 54.90 % | 82.37 % |
Ink | LVE shear stress (Pa) | LVE G′ (Pa) | LVE G″ (Pa) | G′/ G″ |
---|---|---|---|---|
CI-1 | 0.15-0.40 | 20.59 | 15.29 | 0.74 |
CI-2 | 0.12-2.51 | 147.72 | 93.86 | 0.63 |
CI-3 | 0.25-6.30 | 983.61 | 494.49 | 0.50 |
CI-4 | 0.15-10.00 | 7154.95 | 2330.92 | 0.32 |
Table 3 Oscillatory stress sweep parameters in the LVE region.
Ink | LVE shear stress (Pa) | LVE G′ (Pa) | LVE G″ (Pa) | G′/ G″ |
---|---|---|---|---|
CI-1 | 0.15-0.40 | 20.59 | 15.29 | 0.74 |
CI-2 | 0.12-2.51 | 147.72 | 93.86 | 0.63 |
CI-3 | 0.25-6.30 | 983.61 | 494.49 | 0.50 |
CI-4 | 0.15-10.00 | 7154.95 | 2330.92 | 0.32 |
Fig. 6. a-d) SEM images of printed lines with different UV-curing conductive inks: a) CI-1, b) CI-2, c) CI-3, and d) CI-4. e) SEM image of the edge of conductive line printed with CI-3. d) Local SEM images of conductive lines printed with CI-3.
Fig. 8. a) Printed line widths of different conductive inks after curing. b) Schematic diagram of conductive ink penetrating into the gap between the screen and the fabric substrate.
Fig. 9. a) Electrical resistance of the conductive lines at different lengths. b) Electrical resistivity of the printed lines using different conductive inks. c) The selected elemental mapping images of the conductive lines printed with CI-3. d) EDS spectrum of the conductive line printed with CI-3.
Element (wt%) | CI-1 | CI-2 | CI-3 | CI-4 |
---|---|---|---|---|
Ag | 93.76 | 89.39 | 88.94 | 82.38 |
C | 3.65 | 5.69 | 6.39 | 9.50 |
O | 2.25 | 4.57 | 4.26 | 7.48 |
N | 0.34 | 0.34 | 0.41 | 0.63 |
Total | 100.00 | 100.00 | 100.00 | 100.00 |
Table 4 Content of elements distributed in conductive lines after UV curing.
Element (wt%) | CI-1 | CI-2 | CI-3 | CI-4 |
---|---|---|---|---|
Ag | 93.76 | 89.39 | 88.94 | 82.38 |
C | 3.65 | 5.69 | 6.39 | 9.50 |
O | 2.25 | 4.57 | 4.26 | 7.48 |
N | 0.34 | 0.34 | 0.41 | 0.63 |
Total | 100.00 | 100.00 | 100.00 | 100.00 |
Fig. 10. a) Electrical resistance change of conductive lines printed with different inks during 500 bending cycles. b) Relative electrical resistance change of conductive lines during 500 bending cycles.
Fig. 11. a) Electrical resistance change of conductive lines printed with different inks during 20 washing cycles. b) Relative electrical resistance change of conductive lines during 20 washing cycles.
Silver | Substrates | Curing | Resistivity (Ω cm) | Bending | Washing | Reference |
---|---|---|---|---|---|---|
Micro flakes 56 wt% | PDMS | 80℃/30 min | 1.35 × 10-3 | [ | ||
Micro fakes 80 wt% | 150℃/30 min | 1.0 × 10-5 | 10% /1000 cycles | [ | ||
Nanoparticles 77 wt % | polyimide films | 200℃/30 min | 5.5 × 10-6 | 50 % /4 mm/1000 cycles a | [ | |
Nanoparticles 30 wt% | Cotton fabric | 60℃/30 min | 2.0 × 10-3 | 700 %/10 mm/300 cycles | [ | |
Nanoparticles 50 wt% | PET fabric | 40℃ | 1.97 × 10-1 | 1700 % /20 cycles b | [ | |
Nanoparticles 44 wt% | UV | 1.0 × 10-4 | [ | |||
Nanoparticles 60 wt% | PCB | UV/7 s | 2.21 × 10-4 | [ | ||
Nano flakes 60 wt% | Coated fabric | UV/20s | 2.06 × 10-5 | 30%/10 mm/500 cycles | 600 %/20 cycles | Present work |
Table 5 Comparison of electrical resistivity, flexibility and washability of present work with reported screen-printed silver conductive inks.
Silver | Substrates | Curing | Resistivity (Ω cm) | Bending | Washing | Reference |
---|---|---|---|---|---|---|
Micro flakes 56 wt% | PDMS | 80℃/30 min | 1.35 × 10-3 | [ | ||
Micro fakes 80 wt% | 150℃/30 min | 1.0 × 10-5 | 10% /1000 cycles | [ | ||
Nanoparticles 77 wt % | polyimide films | 200℃/30 min | 5.5 × 10-6 | 50 % /4 mm/1000 cycles a | [ | |
Nanoparticles 30 wt% | Cotton fabric | 60℃/30 min | 2.0 × 10-3 | 700 %/10 mm/300 cycles | [ | |
Nanoparticles 50 wt% | PET fabric | 40℃ | 1.97 × 10-1 | 1700 % /20 cycles b | [ | |
Nanoparticles 44 wt% | UV | 1.0 × 10-4 | [ | |||
Nanoparticles 60 wt% | PCB | UV/7 s | 2.21 × 10-4 | [ | ||
Nano flakes 60 wt% | Coated fabric | UV/20s | 2.06 × 10-5 | 30%/10 mm/500 cycles | 600 %/20 cycles | Present work |
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