J. Mater. Sci. Technol. ›› 2019, Vol. 35 ›› Issue (6): 1165-1174.DOI: 10.1016/j.jmst.2018.12.018
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Shuang Jianga, Ru Lin Pengb, Nan Jiaa*(), Xiang Zhaoa, Liang Zuoa
Received:
2018-08-29
Revised:
2018-10-29
Accepted:
2018-11-16
Online:
2019-06-20
Published:
2019-06-19
Contact:
Jia Nan
About author:
1 These authors contributed equally to this work.
Shuang Jiang, Ru Lin Peng, Nan Jia, Xiang Zhao, Liang Zuo. Microstructural and textural evolutions in multilayered Ti/Cu composites processed by accumulative roll bonding[J]. J. Mater. Sci. Technol., 2019, 35(6): 1165-1174.
Number of ARB cycles | Number of layers | Nominal thickness of a single layer, h (μm) | Equivalent true strain, e |
---|---|---|---|
1 | 7 | 300 | 1.39 |
2 | 14 | 107 | 2.58 |
3 | 42 | 31 | 4.01 |
4 | 126 | 10.3 | 5.28 |
5 | 126 | 2.6 | 6.87 |
Table 1 Variation of the number of layers, the nominal thickness of one single layer and the total strain with the increasing ARB cycles.
Number of ARB cycles | Number of layers | Nominal thickness of a single layer, h (μm) | Equivalent true strain, e |
---|---|---|---|
1 | 7 | 300 | 1.39 |
2 | 14 | 107 | 2.58 |
3 | 42 | 31 | 4.01 |
4 | 126 | 10.3 | 5.28 |
5 | 126 | 2.6 | 6.87 |
Fig. 1. EBSD orientation map showing initial grain morphologies and orientation distributions of the annealed pure metals: (a) Ti and (b) Cu. The orientation maps exhibit grain orientations with respect to ND. ODF sections are shown in (c) for Ti and (d) for Cu. (Color should be used for these figures in print).
Fig. 2. SEM micrographs showing lamellar morphologies in the Ti/Cu composites produced by ARB: (a) 1 cycle, (b) 2 cycles, (c) 3 cycles, (d) 4 cycles, (e) 5 cycles.
Fig. 3. (a) TEM image of the ARB processed Ti/Cu multilayers after the first cycle, (b) HRTEM image of the Ti/Cu interface obtained from (a). Inserted image in HRTEM image is Fourier-transformed image, which is obtained from the white dashed rectangular.
Fig. 4. (a) Schematic diagram showing the positions for TEM characterization. The longitudinal section of the Ti/Cu composite after the fifth ARB cycle is observed. Three dashed rectangular highlight the selected areas I, II and III, respectively. (b) TEM micrographs of area I, (c) TEM micrographs of area II, (d) TEM micrographs of area III. White dashed lines indicate the heterophase interface.
Fig. 5. Nanobeam diffraction patterns, EDS analysis and HRTEM image of the Ti/Cu composite processed after the fifth ARB cycle: (a) nanobeam diffraction (NBD) patterns obtained from the position in Fig. 4(b) (as marked by arrow at the heterophase interface), (b) positions of EDS analysis, (c) HRTEM image obtained from the position in (b) as marked by white dashed rectangular, (d) Fourier-transformed image obtained from the white dashed rectangular in (c), (e) NBD patterns obtained from the position in (b) as marked by arrow.
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | |
---|---|---|---|---|---|---|---|---|---|---|
Ti (at.%) | 48.0 | 47.9 | 51.3 | 46.6 | 57.3 | 59.7 | 28.7 | 16.3 | 4.9 | 5.0 |
Cu (at.%) | 52.0 | 52.1 | 48.7 | 63.4 | 42.7 | 40.3 | 71.3 | 83.7 | 95.1 | 95.0 |
Phase | CuTi | CuTi | CuTi | CuTi | CuTi | CuTi | amo. | amo. | amo. | amo. |
Table 2 EDS analysis of the Ti/Cu composite processed after the fifth ARB cycle.
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | |
---|---|---|---|---|---|---|---|---|---|---|
Ti (at.%) | 48.0 | 47.9 | 51.3 | 46.6 | 57.3 | 59.7 | 28.7 | 16.3 | 4.9 | 5.0 |
Cu (at.%) | 52.0 | 52.1 | 48.7 | 63.4 | 42.7 | 40.3 | 71.3 | 83.7 | 95.1 | 95.0 |
Phase | CuTi | CuTi | CuTi | CuTi | CuTi | CuTi | amo. | amo. | amo. | amo. |
Fig. 6. ODF sections with constant φ2 in Ti (on the left) and Cu (on the right) processed after different ARB cycles: (a) prior to ARB processing, (b) after the first cycle, (c) after the second cycle, (d) after the third cycle, (e) after the fourth cycle, (f) after the fifth cycle.
Orientation | m | |
---|---|---|
Prismatic < a> | Basal < a> | |
(0°, 32°, 0°) | 0.43 | 0 |
(0°, 32°, 30°) | 0.43 | 0 |
(0°, 90°, 0°) | 0.43 | 0 |
(45°, 90°, 0°) | 0.22 | 0.43 |
(90°, 90°, 0°) | 0 | 0 |
Table 3 The maximum Schmid factors of the Prismatic < a> slip and Basal < a> slip systems for Ti under uniaxial tension.
Orientation | m | |
---|---|---|
Prismatic < a> | Basal < a> | |
(0°, 32°, 0°) | 0.43 | 0 |
(0°, 32°, 30°) | 0.43 | 0 |
(0°, 90°, 0°) | 0.43 | 0 |
(45°, 90°, 0°) | 0.22 | 0.43 |
(90°, 90°, 0°) | 0 | 0 |
Fig. 7. Tensile stress-strain curves for the Ti/Cu composites processed by different ARB cycles: (a) engineering stress-strain curves, (b) true stress-strain curves.
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