J. Mater. Sci. Technol. ›› 2017, Vol. 33 ›› Issue (7): 698-702.DOI: 10.1016/j.jmst.2016.11.030
• Orginal Article • Previous Articles Next Articles
Li L.L., Zhang Z.J., Zhang P., Tan J., Yang J.B., Zhang Z.F.*()
Received:
2016-06-15
Revised:
2016-11-29
Accepted:
2016-11-30
Online:
2017-07-20
Published:
2017-08-29
Contact:
Zhang Z.F.
Li L.L., Zhang Z.J., Zhang P., Tan J., Yang J.B., Zhang Z.F.. Deformation behaviors of Cu bicrystals with an inclined twin boundary at multiple scales[J]. J. Mater. Sci. Technol., 2017, 33(7): 698-702.
Fig. 1. (a) Compression stress-strain curves of the bicrystal micropillars and the tension and compression stress-strain curves of the bulk bicrystals. (b) Compression stress-strain curves of the two component single crystal micropillars. M: (<1 4 5>) and T: (<1 6 24>).
Fig. 3. Surface morphologies of the bicrystal micropillars. (a) B-4 before compression; (b) B-2 after compression; (c) B-4 after compression; (d) local enlarged image of B-4 after compression. The upper grain is the M grain while the lower one is the T grain.
Fig. 4. (a) Slip morphologies of the bulk bicrystal with a tensile strain of ~2%; (b) slip morphology of the bulk bicrystal with a compressive strain of ~2%; (c) slip morphology and (D) TB fatigue cracking behavior of bulk bicrystal. The right grain is M grain while the left one is the T grain.
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