Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

doi:10.1016/j.jmst.2014.06.009

Abstract

Abstract: Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, and temperature cycling. The shear strengths for Fe-75Ni, Fe-50Ni, and Fe-30Ni solder joints after reflow were 42.57, 53.94 and 53.98 MPa, respectively, which were all satisfied the requirement of industrialization (>34.3 MPa). High temperature storage was conducted at 150, 175 and 200 °C. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region below 150 °C, and the growth speed of intermetallic compound (IMC) decreased with increasing Fe concentration. When stored at 200 °C, the IMC thickness reached a limit for all three films after 4 days, and some cracks occurred at the interface between IMC and Fe-Ni layer. The activation energies for the growth of FeSn₂ on Fe-30Ni, Fe-50Ni, and Fe-75Ni films were calculated as 246, 185, and 81 kJ/mol, respectively. Temperature cycling tests revealed that SnAgCu/Fe-50Ni solder joint had the lowest failure rate (less than 10%), and had the best interfacial reliability among three compositions.

Key words: Fe-Ni alloy, Under bump metallization (UBM), Intermetallic compound (IMC), Reliability, High temperature storage, Temperature cycling

Hao Zhang, Qing-Sheng Zhu, Zhi-Quan Liu, Li Zhang, Hongyan Guo, Chi-Ming Lai. Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints[J]. J. Mater. Sci. Technol., 2014, 30(9): 928-933.

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