J. Mater. Sci. Technol. ›› 2007, Vol. 23 ›› Issue (04): 433-448.
• 论文 • 下一篇
何刚
收稿日期:
2007-02-01
修回日期:
2007-03-07
出版日期:
2007-07-28
发布日期:
2009-10-10
通讯作者:
何刚
Gang HE, Lide ZHANG
Received:
2007-02-01
Revised:
2007-03-07
Online:
2007-07-28
Published:
2009-10-10
Contact:
Lide ZHANG
何刚. Current Progress of Hf (Zr)-Based High-k Gate Dielectric Thin Films[J]. J. Mater. Sci. Technol., 2007, 23(04): 433-448.
Gang HE, Lide ZHANG. Current Progress of Hf (Zr)-Based High-k Gate Dielectric Thin Films[J]. J Mater Sci Technol, 2007, 23(04): 433-448.
[1 ] G.E.Moore:Electronics.,1965,38,19. [2 ] R.H.Dennard:IEEE J.Solid-St.Circ.,1974,9,256. [3] P.Packan:Science,1999,285,2079. [4 ] M.Schulz:Nature,1999,399,729. [5 ] D.Muller,T.Sorsch,S.Moccio,F.Baumann,K.Evans- Lutterodt and G.Timp:Nature,1999,399,758. [6 ] Z.Q.Yao:IEEE Electr.Device L.,1995,16,1600. [7] K.A.Ellis and R.A.Buhrman:Appl.Phys.Lett.,1999, 74,967. [8] K.A.Ellis and R.A.Buhrman:J.Electrochem.Soc., 1998,145,2068. [9 ] G.Lucovsky,Y.Wu,H.Niimi,V.Misra and J.C.Phillips:Appl.Phys.Lett.,1999,74,2005. [10] H.Yang and G.Lucovsky:Tech.Dig.Int.Electron. Device.Meet.,1999,245. [11] S.L.Zhang,J.T.Wang,W.Kaplan and M.Osting:Thin Solid Films,1992,213,182. [12] D.Wang,T.P.Ma,J.W.Golz,B.L.Halpern and J.Schmitt:IEEE Electr.Device.L.,1992,13,482. [13] H.Goto,K.Shibahara and S.Yokoyama:Appl.Phys. Lett.,1996,68,3257. [14] K.Kumar,C.Lin,P.Choudhry and J.C.Lee:Appl. Phys.Lett.,1997,70,384. [15] Z.Q.Yao,H.B.Harrison,S.Dimitrijev,Y.T.Yeow and D.Sweatman:Appl.Phys.Lett.,1994,64,3584. [16] R.I.Hegde,P.J.Tobin,K.G.Reid,B.Maiti and S.A.Ajuria:Appl.Phys.Lett.,1995,66,2882. [17] M.Bhat,L.K.Han,D.Wristers,J.Yan,D.L.Kwong and J.Fulford:Appl.Phys.Lett.,1995,66,1225. [18] H.C.Lu,E.P.Gusev,T.Gustafsson,E.Garfunkel, M.L.Green,D.Brasen and L.C.Feldman:Appl.Phys. Lett.,1996,69,2713. [19] M.Bhat,L.K.Han,D.Wristers,J.Yan,D.L.Kwong and J.Fulford:Appl.Phys.Lett.,1995,66,1225. [20]K.Kumar,A.I.Chou,C.Lin,P.Choudhury and J.C.Lee:Appl.Phys.Lett.,1997,70,384. [21] I.C.Kizilyalli,R.Y.S.Huang and P.K.Roy:IEEE Electr.Device L.,1998,19,423. [22] M.H.Cho,D.H.Ko,Y.G.Choi,K.Jeong,D.Y.Noh, H.J.Kim and C.N.Whang:J.Vac.Sci.Technol.A, 2001,19,192. [23] G.B.Alers,D.J.Werder,Y.Chabal,H.C.Lu, E.P.Gusev,E.Garfunkel,T.Gustafsson and R.S.Urgahl:Appl.Phys.Lett.,1998,73,1517. [24] S.A.Campbell,D.C.Gilmer,X.Wang,M.Hsieh, H.S.Kim,W.L.Gladfelter and J.Yan:IEEE T.Electr. Dev.,1997,44,104. [25] J.H.Lee,K.Koh.N.I.Lee,M.H.Cho,Y.K.Kim, J.S.Jeon,K.H.Cho,H.S.Shin,M.H.Kim,K.Fujihara, H.K.Kang and J.T.Moon:Tech.Dig.Int.Electron. Device.Meet,2000,645. [26] I.Pallecchi,G.Grassano,D.Marre,L.Pellegrino, M.Putti and A.S.Siri:Appl.Phys.Lett.,2001,78, 2244. [27] T.M.Klein,D.Niu,W.S.Epling,W.Li,D.M.Maher, C.C.Hobbs,R.I.Hegde,I.J.R.Baumvol and G.N.Parsons:Appl.Phys.Lett.,1999,75,4001. [28] B.Cheng,M.C.Cao,R.Rao,A.Inani,P.V.Voorde, W.M.Greene,J.M.C.Stork,Z.Yu,M.Zeitzoff and J.C.S.Woo:IEEE T.Electr.Dev.,1999,46,1537. [29] J.Vuillod:J.Vac.Sci.Technol.A,1987,5,1675. [30] J.A.Diniz,P.J.Tatsch and M.A.A.Pudenzi:Appl. Phys.Lett.,1996,69,2214. [31] H.Hwang,W.Ting,D.L.Kwong and J.C.Lee:Interna- tional Electron Devices Meeting,IEDM Technical Di- gest,1990,421. [32]K.J.Hubbard and D.G.Schlom:J.Mater.Res.,1996, 15,2757. [33] W.J.Qi,R.Nieh,B.H.Lee,L.G.Kang,Y.Jeon, K.Onishi,T.Ngai,S.Banerjee and J.C.Lee:Tech.Dig. Int.Electron.Device.Meet.,1999,145. [34] L.Kang,B.H.Lee,W.J.Qi,Y.Jeon,R.Nieh,S.Gopalan, K.Onishi and J.C.Lee:IEEE Electr.Device.L.,2000, 21,181. [35] G.D.Wilk,R.M.Wallace and J.M.Anthony:J.Appl. Phys.,2000,87,484. [36]S.P.Mukura and C.C.Chang:Appl.Phys.Lett.,1980, 37,639. [37] M.Balog and M.Schieber:Thin Solid Films,1977,41, 241. [38] S.Gopalan,K.Onishi,R.Nieh,C.S.Kang,R.Choi, H.J.Cho,S.Krishnan and J.C.Lee:Appl.Phys.Lett., 2002,80,4416. [39] M.R.Vosakay,J.J.Chambers,A.L.P.Rotondaro, A.Shanware and L.Colombo:Appl.Phys.Lett., 2002,80,3183. [40] G.D.Wilk and R.M.Wallace:Appl.Phys.Lett.,1999, 74,2854. [41] X.B.Lu,Z.G.Liu,Y.P.Wang,Y.Yang,X.P.Wang, H.W.Zhou and B.Y.Nguyen:J.Appl.Phys.,2003, 94,1229. [42] A.D.Li,Q.Y.Shao,H.Q.Ling,J.B.Cheng,D.Wu, Z.G.Liu,N.B.Ming,Cathy Wang,H.W.Zhou and B.Y.Nguyen:Appl.Phys.Lett.,2003,83,3540. [43]H.Kim and P.C.McIntyre:J.Appl.Phys.,2002,92, 5094. [44] T.Y.Chang,T.F.Lei,T.S.Chao,H.C.Wen and H.W.Chen:IEEE Electr.Device L.,2002,23,389. [45] A.Rahtu,M.Ritala and M.Leskela:Chem.Mater., 2001,13,1528. [46] D.Hausmann,J.Becker,S.L.Wang and R.G.Gordon: Science,2002,298,402. [47] M.Leskela and M.Ritala:Thin Solid Films,2002,409, 138. [48] M.J.Biercuk,D.J.Monsma,C.M.Marcus,J.S.Becker and R.G.Gordon:Appl.Phys.Lett.,2003,83,2405. [49] B.S.Lim,A.Rahtu and R.G.Gordon:Nat.Mater., 2003,2,749. [50] T.Aaltonen,M.Ritala,K.Arstila,J.Keinonen and M.Leskela:Chem.Vapor.Depos.,2004,10,215. [51] K.Tokita and F.Okada:J.Appl.Phys.,1996,80, 7073. [52] J.Y.Zhang and I.W.Boyd:Appl.Phys.Lett.,2000, 77,3574. [53] I.W.Boyd and J.Y.Zhang:Solid State Electron.,2001, 45,1413. [54] R.P.Roland,M.Bolle and R.W.Anderson:Chem. Mater.,2001,13,2493. [55] A.Watanabe,T.Tsuchiya and Y.Imai:Thin Solid Films,2002,406,132. [56] A.Santoni:J.Cryst.Growth,2003,258,272. [57] Q.Fang,J.Y.Zhang,Z.M.Wang,G.He,J.Yu and I.W.Boyd:Microelectron.Eng.,2003,66,621. [58] E.Halary-Wagner,T.Bret and P.Hoffmann:Chem. Vapor.Depos.,2005,11,21. [59] K.Yamamoto,S.Hayashi,M.Kubota and M.Niwa: Appl.Phys.Lett.,2002,81,2053. [60] S.W.Nam,J.H.Yoo,S.Nam,H.J.Choi,D.Lee,D.H.Ko, J.H.Moon,J.H.Ku and S.Choi:J.Non-Cryst.Solids, 2002,303,139. [61] G.He,Q.Fang,M.Liu,L.Q.Zhu and L.D.Zhang:J. Cryst.Growth.,2004,268,155. [62] P.K.Roy and I.C.Kizilyalli:Appl.Phys.Lett.,1998, 72,2835. [63] J.Morais,L.Miotti,G.V.Soares,S.R.Teixeira,R.Pezzi, K.P.Bastos,A.L.P.Rotondaro,J.J.Chambers and M.R.Visokay:Appl.Phys.Lett.,2002,81,2995. [64] J.Zhu,T.L.Li,B.Pan,L.Zhou and Z.G.Liu:J.Phys. D-Appl.Phys.,2003,36,389. [65] G.He,M.Liu,L.Q.Zhu,M.Chang,Q.Fang and L.D.Zhang:Surf.Sci.,2005,576,67. [66] G.He,L.D.Zhang,G.H.Li,M.Liu,L.Q.Zhu,S.S.Pan and Q.Fang:Appl.Phys.Lett.,2005,86,232901. [67] M.Liu,G.He,L.Q.Zhu,Q.Fang,G.H.Li and L.D.Zhang:Appl.Surf.Sci,2006,252,6206. [68] G.He,Q.Fang,L.Q.Zhu,M.Liu and L.D.Zhang: Chem.Phys.Lett.,2004,395,259. [69] G.He,J.X.Zhang,L.Q.Zhu,M.Liu,Q.Fang and L.D.Zhang:Nanotechnology,2005,16,1641. [70] J.Zhu,Z.G.Liu and Y.Feng:J.Phys.D-Appl.Phys., 2003,36,3051. [71] J.Zhu,Z.G.Liu and Y.R.Li:J.Phys.D-Appl.Phys., 2005,38,446. [72]J.Okabayashi,S.Toyoda,H.Kumigashira,M.Oshima, K.Usuda,M.Niwa and G.L.Liu:J.Vac.Sci.Technol. A,2005,23,1554. [73]M.A.Quevedo-Lopez,J.J.Chambers,M.R.Visokay, A.Shanware and L.Colombo:Appl.Phys.Lett.,2005, 87,012902. [74] G.Pant,A.Gnade,M.J.Kim,R.M.Wallace, B.E.Gnade,M.A.Quevedo-Lopez and P.D.Kirsch: Appl.Phys.Lett.,2006,88,032901. [75] K.Kita,K.Kyuno and A.Toriumi:Appl.Phys.Lett., 2005,86,102906. [76] L.Q.Zhu,Q.Fang,G.He,M.Liu and L.D.Zhang: Mater.Lett.,2006,60,888. [77] H.Watanabe,N.Ikaxashi and F.Ito:Appl.Phys.Lett., 2003,83,3546. [78] K.I.Seo,P.C.Mclntyre,H.Kim and K.C.Saraswat: Appl.Phys.Lett.,2005,86,082904. [79] W.Zhu,T.P.Ma,T.Tamagawa,Y.Di,J.Kim, R.Carruthers,M.Gibso and T.Furukawa:Tech.Dig. Int.Electron Device Meet,2001,20.4.1. [80] C.H.Choi,S.J.Rhee,T.S.Jeon,N.Lu,J.H.Sim, R.Clark,M.Niwa and D.L.Kwang:Tech.Dig.Int. Electron Device Meet,2002,865. [81] K.J.Choi,J.H.Kim and S.G.Yoon:J.Electrochem. Soc.,2004,151,G262. [82] G.V.Soares,K.P.Bastos,R.P.Pezzi,L.Miotti, C.Driemeier,I.J.R.Baumvol,C.Hinkle and G.Lucovsky:Appl.Phys.Lett.,2004,84,4992. [83]H.Y.Yu,N.Wu,M.F.Li,C.X.Zhu,B.J.Cho, D.L.Kwang,C.L.Tung,J.S.Pan,J.W.Chai, W.D.Wang,D.Z.Chi,C.H.Ang,J.Z.Chi and S.Ramanathan:Appl.Phys.Lett.,2002,81,3618. [84]M.H.Cho,Y.S.Roh,C.N.Whang,K.Jeong,H.J.Choi, S.W.Nam,D.H.Ko,J.H.Lee,N.I.Lee and K.Fujihara: Appl.Phys.Lett.,2002,81,1071. [85]H.Y.Yu,M.F.Li,B.J.Cho,C.C.Yeo,M.S.Joo, D.L.Kwang,J.S.Pan,C.H.Ang,J.Z.Zheng and S.Ramanathan:Appl.Phys.Lett.,2002,81,376. [86] G.He,Q.Fang and L.D.Zhang:Mater.Sci.Semicon. Proc.,2006,9,870. [87] L.Q.Zhu,L.D.Zhang,G.H.Li,G.He,M.Liu and Q.Fang:Appl.Phys.Lett.,2006,88,232901. [88] B.Y.Tsui and H.W.Chang:J.Appl.Phys.,2003,93, 10119. [89] Y.Hoshino,Y.Kido,K.Yamamoto,S.Hayashi and M.Niwa:Appl.Phys.Lett.,2002,81,2650. [90] V.Craciun,J.M.Howard,N.D.Bassim and R.K.Singh: Appl.Surf.Sci.,2001,68,123. [91] J.Robertson:J.Vac.Sci.Technol.B,2000,18,1785. [92] Y.J.Cho,N.V.Nguyen,C.A.Richter,J.R.Ehrstein, B.H.Lee and J.C.Lee:Appl.Phys.Lett.,2002,80, 1249. [93]H.Takeuchi,D.Ha and T.J.King:J.Vac.Sci.Technol. A,2004,22,1337. [94]S.Venkataraj,O.Kappertz,H.Weis,R.Drese, R.Jayavel and M.Wuttig:J.Appl.Phys.,2002,92, 3599. [95]C.Morant,A.Fernandez,A.R.Gonzalez-Elipe, L.Soriano,A.Stampfl,A.M.Bradshaw and A.M.Sanz: Phys.Rev.B,1995,52,11711. [96] M.Liu,Q.Fang,G.He,L.Li,L.Q.Zhu,G.H.Li and L.D.Zhang:Appl.Phys.Lett.,2006,88,192904. [97] P.Chen,H.B.Bhandari and T.M.Klein:Appl.Phys. Lett.,2004,85,1574. [98] C.H.Choi,T.S.Jeon,R.Clark and D.L.Kwang:IEEE Electr.Device L.,2003,24,215. [99] C.S.Kang,H.J.Cho,K.Onishi,R.Nieh,R.Choi, S.Gopanlan,S.Krishnan,J.H.Han and J.C.Lee:Appl. Phys.Lett.,2002,81,2593. [100] S.H.Mohamed,O.Kappertz,T.Niemeier,R.Drese, M.M.Wakkad and M.Wuttig:Thin Solid Films,2004, 468,48. [101] R.Asahi,T.Morikawa,T.Ohwaki,K.Aoki and Y.Taga: Science,2001,293,269. [102] G.Shang,P.W.Peacock and J.Robertson:Appl.Phys. Lett.,2004,84,106. [103] P.Kroll:Phys.Rev.Lett.,2003,90,125501. [104] S.G.Lim,S.Kriventsov,T.N.Jackson,J.H.Haeni, D.G.Schlom,A.M.Balbashov,R.Uecker,P.Reiche, J.L.Freeouf and G.Lucovsky:J.Appl.Phys.,2002, 92,4500. [105] J.L.Gavartin,A.L.Shluger,A.S.Foster and G.I.Bersuker:J.Appl.Phys.,2005,97,053704. [106] C.S.Kang,H.J.Cho,K.Onishi,R.Nieh,R.Choi, S.Gopanlan,S.Krishnan,J.H.Han and J.C.Lee:Appl. Phys.Lett.,2002,81,2593. [107] J.F.Kang,H.Y.Yu,C.Ren,M.F.Li,D.S.H.Chan,H.Hu H.F.Lim,W.D.Wang,D.Gui and D.L.Kwong:Appl. Phys.Lett.,2004,84,1588. [108] M.Lee,Z.H.Lu,W.T.Ng,D.Landheer,X.Wu and S.Moisa:Appl.Phys.Lett.,2003,83,2638. [109] J.F.Kang,H.Y.Yu,C.Ren,M.F.Li,D.S.H.Chan, H.Hu,H.F.Lim,W.D.Wang D.Gui and D.L.Kwong: Appl.Phys.Lett.,2004,84,1588. [110] K.J.Choi,J.H.Kim,S.G.Yoon and W.C.Shin:J.Vac. Sci.Technol.B,2004,22,1755. [111] K.Hukari,R.Dannenberg and E.A.Stach:J.Mater. Res.,2002,17,550. [112] Y.Baba,T.A.Sasaki and I.Takano:J.Vac.Sci.Tech- nol.A,1988,6,2945. [113] J.A.Taylor:Appl.Surf.Sci.,1981,7,168. [114] G.Pant,P.Punchaipetch,M.J.Kim,R.M.Wallace and B.E.Gnade:Thin Solid Films,2004,460,242. [115] A.Kumar,D.Rajdev and D.L.Douglass:J.Am.Chem. Soc.,1972,55,439. [116] N.Martin,O.Banakh,A.M.E.Santo,S.Springer, R.Sanjinés,J.Takadoum and F.Levy:Appl.Surf. Sci.,2001,185(1-2),123. [117] S.Sayan:Appl.Phys.Lett.,2006,87,212905. [118] S.J.Wang,A.C.H.Huan,Y.L.Foo,J.W.Chai,J.S.Pan, Q.Li,Y.F.Dong,Y.P.Feng and C.K.Ong:Appl.Phys. Lett.,2004,85,4418. [119] S.Miyazaki:J.Vac.Sci.Technol.B,2001,19,2212. [120] A.Abrutis,V.Kubilius,V.Bigelyte,A.Teiserskis, Z.Saltyte,J.P.Senateur and F.Weiss:Mater.Lett., 1997,31,201. [121] Y.Ohshita,A.Ogura,A.Hoshino and S.Hiiro:J.Cryst. Growth,2001,233,292. [122] K.Takahashi,M.Nakayama,S.Yokoyama,T.Kimura, E.Tokumitsu and H.Funakubo:Appl.Surf.Sci.,2003, 216,296. [123] Y.Chou,H.T.Chiu,T.F.Kuo,C.C.Chi and S.H.Chuang:Appl.Phys.Lett.,2006,89,252901. [124] P.D.Kirsch,M.A.Quevedo-Lopez,S.A.Krishnan, B.H.Lee,G.Pant,M.J.Kim,R.M.Wallace and B.E.Gnade:Appl.Phys.Lett.,2006,89,242909. [125] X.Y.Qiu,Q.M.Liu,F.Gao,L.Y.Lu and J.M.Liu:Appl. Phys.Lett.,2006,89,242504. [126] C.C.Cheng,C.H.Chien,J.H.Lin,C.Y.Chang, G.L.Luo,C.H.Yang and S.L.Hsu:Appl.Phys.Lett., 2006,89,012905. [127] M.T.Wang,B.Y.Y.Cheng and J.Y.M.Lee:Appl. Phys.Lett.,2006,89,242905. |
阅读次数 | ||||||
全文 |
|
|||||
摘要 |
|
|||||