J. Mater. Sci. Technol. ›› 2007, Vol. 23 ›› Issue (04): 495-498.

• 论文 • 上一篇    下一篇

Diamond Film Synthesis with a DC Plasma Jet: Effect of the Contacting Interface between Substrate and Base on the Substrate Temperature

陈荣发;左敦稳;许锋;李多生;王珉   

  1. 南京航空航天大学;扬州大学
  • 收稿日期:2006-09-04 修回日期:2006-12-05 出版日期:2007-07-28 发布日期:2009-10-10
  • 通讯作者: 陈荣发

Diamond Film Synthesis with a DC Plasma Jet: Effect of the Contacting Interface between Substrate and Base on the Substrate Temperature

Rongfa CHEN, Dunwen ZUO, Feng XU, Duoseng LI, Min WANG   

  1. Department of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China...
  • Received:2006-09-04 Revised:2006-12-05 Online:2007-07-28 Published:2009-10-10
  • Contact: Rongfa CHEN

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摘要： 在直流等离子体喷射化学气相沉结金刚石膜的过程中, 基体钼块和水冷铜基座之间的连接界面对钼块表面金刚石膜的沉积温度影响很大。本文以连接界面为研究对象，分别从接触界面的传热材料、固相接触面积、基片与沉积台的同轴定位三个方面进行了详细的实验研究,结果表明特种Sn-Pb合金导热效率很高、固相接触面积大于总面积的60%时温度稳定、采用固定环结构进行同轴定位传热性能好，并对不同温度下金刚石膜的生长形态进行了研究。对高速度、高质量制备大面积金刚石膜具有重要的工程意义。

关键词: 金刚石膜, 基体温度, 连接界面, 直流等离子体

Abstract: The contacting interface between the substrate and water-cooled base is vital to the substrate temperature during diamond films deposition by a DC (direct current) plasma jet. The effects of the solid contacting area, conductive materials and fixing between the substrate and the base were investigated without affecting the other parameters. Experimental results indicated that the preferable solid contacting area was more than 60% of total contacting areal; the particular Sn-Pb alloy was more suitable for conducting heat and the concentric fixing ring was a better setting for controlling the substrate temperature. The result was explained in terms of the variable thermal contact resistance at the interface between substrate and base. The diamond films were analyzed by scanning electron microscopy (SEM) for morphology, X-ray diffraction (XRD) for the intensity of characteristic spectroscopy and Raman spectroscopy for structure.

Key words: diamond films, substrate temperature, contacting interface, DC arc plasma jet