J. Mater. Sci. Technol. ›› 2007, Vol. 23 ›› Issue (03): 304-306.
韩秀峰
X.F.Han, H.X.Wei, Z.L.Peng, H.D.Yang, J.F.Feng, G.X.Du, Z.B.Sun, L.X.Jiang, Q.H.Qin, M.Ma, Y.Wang, Z.C.Wen, D.P.Liu, W.S.Zhan
摘要: Nano-ring-type magnetic tunnel junctions (NR-MTJs) with the layer structure of Ta(5)/Ir22Mn78(10)/Co75Fe25(2)/Ru(0.75)/Co60Fe20B20(3)/Al(0.6)-oxide/Co60Fe20B20(2.5)/Ta(3)/ Ru(5) (thickness unit: nm) were nano-fabricated on the Si(100)/SiO2 substrate using magnetron sputtering deposition combined with the optical lithography, electron beam lithography (EBL) and Ar ion-beam etching techniques. The smaller NR-MTJs with the outer- and inner-diameter of around 100 and 50 nm and also their corresponding NR-MTJ 4x4 arrays were nano-patterned. The tunneling magnetoresistance (TMR & R) versus driving current (I) loops for a spin-polarized current switching were measured, and the TMR ratio of around 20% at room temperature were observed. The critical values of switching current for the free Co60Fe20B20 layer relative to the reference Co60Fe20B20 layer between parallel (clockwise) and anti-parallel (anti-clockwise) magnetization states were between 0.50 and 0.65 mA in such NR-MTJs. It is suggested that the applicable MRAM fabrication with the density and capacity higher than 256 Mbite/inch2 even 6 Gbite/inch2 are possible using both 1 NR-MTJ + 1 transistor structure and current switching mechanism based on this experimental results based on our fabricated 4x4 MRAM Demo devices.