Nanostructures and nanoprecipitates induce high strength and high electrical conductivity in a CuCrZr alloy

doi:10.1016/j.jmst.2019.12.022

材料科学与技术 ›› 2020, Vol. 48 ›› Issue (0): 18-22.DOI: 10.1016/j.jmst.2019.12.022

收稿日期:2019-10-10 接受日期:2019-12-12 出版日期:2020-07-01 发布日期:2020-07-13

Nanostructures and nanoprecipitates induce high strength and high electrical conductivity in a CuCrZr alloy

Z.Y. Zhang^a^,^b, L.X. Sun^a^,^c^,^*(), N.R. Tao^a

^a Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
^b School of Materials Science and Engineering, University of Science and Technology of China, Hefei 230026, China
^c College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China

Received:2019-10-10 Accepted:2019-12-12 Online:2020-07-01 Published:2020-07-13
Contact: L.X. Sun

摘要/Abstract

Abstract:

The mixed nanostructure mainly consisting of nanotwins and nanograins was obtained in a solid solution CuCrZr alloy by means of dynamic plastic deformation at cryogenic temperature. After subsequent aging treatments, the precipitation of Cr at nanometer scale provided further strengthening and brought substantial recovery of electrical conductivity. The aged nanostructured CuCrZr alloy exhibited a high tensile strength of 832 MPa and a high electrical conductivity of 71.2% IACS. The details of precipitation tuned by nanotwin boundaries were demonstrated in this work. The combined strengthening of nanostructures and nanoprecipitates was discussed.

Key words: CuCrZr alloy, Nanotwins, Precipitation hardening, Aging, Electrical conductivity

. [J]. 材料科学与技术, 2020, 48(0): 18-22.

Z.Y. Zhang, L.X. Sun, N.R. Tao. Nanostructures and nanoprecipitates induce high strength and high electrical conductivity in a CuCrZr alloy[J]. J. Mater. Sci. Technol., 2020, 48(0): 18-22.

图/表 6

Fig. 1. Typical cross-sectional bright-field TEM images of solid solution treated DPD samples (SST-DPD): (a) nanotwins (NTs); (b) nanograins (NGs); (c) dislocation structures (DSs).

Fig. 2. Bright-field TEM morphology of SST-DPD samples after aging at 400 °C for 3 h (aged DPD).

Fig. 3. (a) High magnification TEM image of SST-DPD samples after aging at 400 °C for 3 h (aged DPD). Insets are SAED patterns of the areas marked with circles; (b) EDS element mapping of Cr taken from the square region in (a). Coarsened precipitates have been pointed out by white arrows; (c, d) atomic resolution HAADF-STEM image and EDS element mapping of Cr on the twin boundary, respectively.

Fig. 4. Variations of microhardness and electrical conductivity of SST-DPD samples as a function of the aging time at 400 °C.

Fig. 5. Tensile engineering stress-strain curves of the solid solution treated coarse grained samples (SST-CG), pre-annealed DPD samples (Annl-DPD), solid solution treated samples after DPD (SST-DPD) and aging at 400 °C for 3 h (aged DPD), respectively.

Fig. 6. Combinations of the electrical conductivity and tensile strength of SST-DPD and aged DPD CuCrZr alloy in comparison with that of the reported CuCr(Zr/Ag) alloys.

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Nanostructures and nanoprecipitates induce high strength and high electrical conductivity in a CuCrZr alloy

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