Wetting behaviors and interfacial reaction between Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

J. Mater. Sci. Technol. ›› 2010, Vol. 26 ›› Issue (2): 156-162.

• Research Articles • 上一篇下一篇

Wetting behaviors and interfacial reaction between Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

Qiulian Zeng¹;Jianjun Guo²;Xiaolong Gu²;Xinbing Zhao³;Xiaogang Liu²

1. Zhejiang Metallurgical Research Institute; Zhejiang University
2. Zhejiang Metallurgical Research Institute
3. Zhejiang University

收稿日期:2008-10-27 修回日期:2009-01-15 出版日期:2010-02-28 发布日期:2010-02-28
通讯作者: Jianjun Guo
基金资助:
浙江省科技厅科技计划;无

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Qiulian Zeng^1,2), Jianjun Guo¹⁾, Xiaolong Gu¹⁾, Xinbing Zhao²⁾, Xiaogang Liu¹⁾

1) Zhejiang Province Key laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China
2) Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China

Received:2008-10-27 Revised:2009-01-15 Online:2010-02-28 Published:2010-02-28
Contact: Jianjun Guo
Supported by:
the Science and Technology Program of Zhejiang Province, China (No. 2008F1024)

摘要/Abstract

Abstract:

Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340{400°C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360°C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn /Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.

Key words: Wetting, Interfacial reaction, High temperature lead-free solder, Sn-10Sb-5Cu solder

Qiulian Zeng Jianjun Guo Xiaolong Gu Xinbing Zhao Xiaogang Liu. Wetting behaviors and interfacial reaction between Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate[J]. J. Mater. Sci. Technol., 2010, 26(2): 156-162.

Qiulian Zeng, Jianjun Guo, Xiaolong Gu, Xinbing Zhao, Xiaogang Liu. Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate[J]. J Mater Sci Technol, 2010, 26(2): 156-162.

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Wetting behaviors and interfacial reaction between Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

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