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| Keywords | |
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Cu-Cr-Sn-Zn alloy |
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Strengthening |
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Aging |
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Rapid solidification |
| Authors | |
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Juanhua Su |
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Fengzhang Ren |
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Baohong Tian |
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Pin Liu |
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Qiming Dong |
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Aging Strengthening in Rapidly Solidified Cu-Cr-Sn- Zn Alloy
Juanhua Su†, Fengzhang Ren, Baohong Tian, Pin Liu and Qiming Dong
College of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
It is known that the strength of alloys can be successfully improved by rapid solidification. The paper presents a process where Cu-Cr-Sn-Zn lead frame alloy is produced by rapid solidification and aging. The microcrystalline structure of rapidly solidified Cu-Cr-Sn-Zn alloy is smaller grain structure examined by optical metallography. The effects of aging processes on the microstructure and properties of the lead frame alloy were investigated. Aged at 500°C for 15 min the fine coherent precipitates Cr distribute in Cu matrix observed by transmission electron microscopy and the properties of hardness and electrical conductivity properties can reach 178HV and 61%IACS, respectively.
the Startup Foundation for Doctor Scientific Research in Henan University of Science and Technology (No. 20061009)
the Special Fund for Important Forepart Research in Henan University of Science and Technology (No. 2008ZD003)
the National Natural Science Foundation of China under grant No. 50771042
| [1] | J.H. Su, Q.M. Dong and P. Liu: J. Mater. Sci. Technol., 2003, 19(6), 529. |
| [2] | K.C. Chan and S.H. Wang: J. Mater. Process. Technol, 2001, 116, 231. |
| [3] | S. Yia, J.K. Kim, C.Y. Yue and J.H. Hsieh: Microelectron. Reliab, 2000, 40, 1207. |
| [4] | F.X. Huang and J.S. Ma: Scripta Mater, 2003, 48, 97. |
| [5] | P. Zhao, M. Pecht: Microelectron. Reliab, 2003, 43, 775. |
| [6] | Q.M. Dong, P. Liu, J.H. Su and H.J. Li: Mater. Sci. Forum, 2005, 475{479, 2713. |
| [7] | H.Y. Lee: Mater. Sci. Eng., A, 2001, 311, 217. |
| [8] | R. Futatsuka: J. Jpn. Copper Brass Res. Assoc., 1997, 36, 25. |
| [9] | J.H. Su, Q.M. Dong, P. Liu and H.J. Li: Mater. Sci. Eng. A, 2005, 392, 422. |
| [10] | M. Motohisa: J. Jpn. Copper Brass Res. Assoc., 1990, 29, 18. |
| [11] | J.H. Su, H.J. Li, Q.M. Dong and P. Liu: Chin. J. Mechan. Eng., 2005, 18(2), 212. |
| [12] | D.M. Zhao, Q.M. Dong and P. Liu: Mater. Chem. Phy, 2003, 79, 81. |
| [13] | H.J. Ryu and H.K. Baik: J. Mater. Sci, 2000, 35, 3641. |
| [14] | M. Xie, J.L.Liu and X.Y. Lu: Sci. Tech. Adv. Mater, 2001, 2, 79. |
| [15] | J.B. Correia: Acta Metall., 1997, 45(1), 177. |
| [16] | E. Batawi, D.G. Morris and M.A. Morris: Mater. Sci. Technol, 1999, 6, 892. |
| [17] | I. Naotsugu: J. Jpn. Copper Brass Res. Assoc., 1985, 24, 225. |
| [18] | F. Rensei: J. Jpn. Copper Brass Res. Assoc., 1988, 27, 109. |
| [19] | P. Liu, B.X. Kang and X.G. Cao: Mater. Sci. Eng., 1999, A265, 262. |
| [20] | P. Liu, B.X. Kang and X.G. Cao: Chin. J. Nonferrous Met., 1999, 9(4), 723. |