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J. Mater. Sci. Technol. 2010, 26(02) 156-162 DOI:     ISSN: 1005-0302 CN: 21-1315/TG
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Keywords
Wetting
Interfacial reaction
High temperature lead-free solder
Sn-10Sb-5Cu solder
Authors
QIULIAN -Zeng
JIANJUN -Guo
XIAOLONG -Gu
XINBING -Zhao
XIAOGANG -Liu
PubMed
Article by Qiulian,.Z
Article by Jianjun,.G
Article by Xiaolong,.G
Article by Xinbing,.Z
Article by Xiaogang,.L

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Qiulian Zeng1,2), Jianjun Guo1), Xiaolong Gu1), Xinbing Zhao2), Xiaogang Liu1)

1) Zhejiang Province Key laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China
2) Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China

Abstract：

Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340{400°C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360°C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn /Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.

Keywords： Wetting   Interfacial reaction   High temperature lead-free solder   Sn-10Sb-5Cu solder  
Received 2008-10-27 Revised 2009-01-15 Online: 2010-02-28 
DOI:
Fund:

the Science and Technology Program of Zhejiang Province, China (No. 2008F1024)

Corresponding Authors: Jianjun Guo
Email: jjguomail@163.com
About author:
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