[1] | Y. He, X. Wang, Y. Gao, Y. Hou, Q. Wan, J. Semicond. 39 (2018) 11005. | [2] | M. Grundmann, F. Klüpfel, R. Karsthof, P. Schlupp, F.L. Schein, D. Splith, C. Yang, S. Bitter, H. von Wenckstern, J.Phys. D-Appl. Phys. 49 (2016), 213001. | [3] | K.H.L. Zhang, K. Xi, M.G. Blamire, R.G. Egdell, J. Phys. Condens. Matter, 28 (2016), 383002. | [4] | G. Hautier, A. Miglio, G. Ceder, G.-M. Rignanese, X. Gonze, Nat. Commun. 4 (2013) 2292. | [5] | Y. Ogo, H. Hiramatsu, K. Nomura, H. Yanagi, T. Kamiya, M. Kimura, M. Hirano, H. Hosono, Phys. Phys. Status Solidi A-Appl.Mat. 206 (2009) 2187-2191. | [6] | V.A. Ha, F. Ricci, G.M. Rignanese, G. Hautier, J. Mater. Chem. C 5 (2017) 5772-5779. | [7] | A. Togo, F. Oba, I. Tanaka, K. Tatsumi, Phys. Rev. B-Condens.Matter Mater. Phys. 74 (2006) 1-8. | [8] | K.J. Saji, Y.P. Venkata Subbaiah, K. Tian, A. Tiwari, Thin Solid Films, 605 (2016) 193-201. | [9] | T. Toyama, Y. Seo, T. Konishi, H. Okamoto, R. Morimoto, Y. Nishikawa, Y. Tsutsumi, Thin Solid Films 555 (2014) 148-152. | [10] | L. Guo, M. Zhao, D. Zhuang, Q. Gong, H. Tan, M. Cao, L. Ouyang, Mater. Sci. Semicond. Process. 46 (2016) 35-38. | [11] | H. Luo, L.Y. Liang, Q. Liu, H.T. Cao, ECS J. Solid State Sci. Technol. 3 (2014), Article Q3091-Q3094. | [12] | S. Hwang, Y.Y. Kim, J.H. Lee, D.K. Seo, J.Y. Lee, H.K. Cho, J. Am. Ceram. Soc. 95 (2012) 324-327. | [13] | X.Q. Pan, L. Fu, J. Appl. Phys. 89 (2001) 6048-6055. | [14] | A. Seko, A. Togo, F. Oba, I. Tanaka, Phys. Rev. Lett. 100 (2008) 45702. | [15] | S. Cahen, N. David, J.M. Fiorani, A. Maitre, M. Vilasi, Thermochim. Acta 403 (2003) 275-285. | [16] | W. Guo, L. Fu, Y. Zhang, K. Zhang, L.Y. Liang, Z.M. Liu, H.T. Cao, X.Q. Pan, Appl. Phys. Lett. 96 (2010) 1-4. | [17] | P.C. Hsu, W.C. Chen, Y.T. Tsai, Y.C. Kung, C.H. Chang, C.C. Wu, H.H. Hsieh, Thin Solid Films 555 (2014) 57-61. | [18] | J. Um, S.E. Kim, ECS Solid State Lett. 3 (2014) P94-P98. | [19] | S.S. Lin, Y.S. Tsai, K.R. Bai, Appl. Surf. Sci. 380 (2016) 203-209. | [20] | K.J. Saji, A.P.R. Mary, ECS J. Solid State Sci. Technol. 4 (2015), Article Q101-Q104. | [21] | H. Luo, L. Liang, H. Cao, ACS Appl. Mater. Interfaces, 4 (2012) 5673. | [22] | S. Bansal, D.K. Pandya, S.C. Kashyap, D. Haranath, J. Alloys Compd. 583 (2014) 186-190. | [23] | C. Kim, S. Kim, S.E. Kim, Thin Solid Films 634 (2017) 175-180. | [24] | K.C. Sanal, M.K. Jayaraj, Mater. Sci. Eng. B-Solid-State Mater.Adv. Technol. 178 (2013) 816-821. | [25] | E.P. Domashevskaya, S.V. Ryabtsev, Y.A. Yurakov, O.A. Chuvenkova, V.M. Kashkarov, S.Y. Turishchev, S.B. Kushev, A.N. Lukin, Thin Solid Films, 515 (2007) 6350-6355. | [26] | E. Fortunato, R. Barros, P. Barquinha, V. Figueiredo, S.H.K. Park, C.S. Hwang, R. Martins, Appl. Phys. Lett. 97 (2010) 3-6. | [27] | I.T. Cho, M. U, S.H. Song, J.H. Lee, H.I. Kwon, Semicond. Sci. Technol. 29 (2014) 45001. | [28] | Y.H. Jiang, I.C. Chiu, P.K. Kao, J.C. He, Y.H. Wu, Y.J. Yang, C.C. Hsu, I.C. Cheng, J.Z. Chen, Appl. Surf. Sci. 327 (2015) 358-363. | [29] | J.A. Caraveo-Frescas, P.K. Nayak, H.A. Al-Jawhari, D.B. Granato, U. Schwingenschlögl, H.N. Alshareef, ACS Nano 7 (2013) 5160-5167. | [30] | S.J. Lee, Y. Jang, H.J. Kim, E.S. Hwang, S.M. Jeon, J.S. Kim, T. Moon, K.T. Jang, Y.C. Joo, D.Y. Cho, C.S. Hwang, ACS Appl. Mater. Interfaces, 10 (2018) 3810-3821. | [31] | C.W. Shih, A. Chin, C.F. Lu, W.F. Su, Sci. Rep. 8 (2018) 1-6. | [32] | D.B. Granato, J.A. Caraveo-Frescas, H.N. Alshareef, U. Schwingenschlögl, Appl. Phys. Lett. 102 (2013) 1-5. | [33] | M.T.S. Nair, C. López-Mata, O.GomezDaza, P.K. Nair, Semicond. Sci. Technol. 18 (2003) 755-759. | [34] | T. Jäger, B. Bissig, M. Döbeli, A.N. Tiwari, Y.E. Romanyuk, Thin Solid Films 553 (2014) 21-25. | [35] | A. Martel, F. Caballero-Briones, P. Bartolo-Pérez, A. Iribarren, R. Castro-Rodríguez, A. Zapata-Navarro, J.L. Pea, Surf. Coat. Technol. 148 (2001) 103-109. | [36] | A. Martel, F. Caballero-Briones, P. Quintana, P. Bartolo-Pérez, J.L. Peña, Surf. Coat. Technol. 201 (2007) 4659-4665. | [37] | L. Sangaletti, L.E. Depero, B. Allieri, F. Pioselli, E. Comini, G. Sberveglieri, M. Zocchi, J. Mater. Res. 13 (1998) 2457-2460. | [38] | X. Jia, Z. Lin, T. Zhang, B. Puthen-Veettil, T. Yang, K. Nomoto, J. Ding, G. Conibeer, I. Perez-Wurfl, RSC Adv. 7 (2017) 34244-34250. | [39] | A. Diéguez, A. Romano-Rodríguez, A. Vilà, J.R. Morante, J. Appl. Phys. 90 (2001) 1550-1557. | [40] | K.N. Yu, Y. Xiong, Y. Liu, C. Xiong, Phys. Rev. B 55 (1997) 2666-2671. | [41] | W.M. Kim, J.S. Kim, J.H. Jeong, J.K. Park, Y.J. Baik, T.Y. Seong, Thin Solid Films 531 (2013) 430-435. | [42] | M. Batzill, U. Diebold, Prog. Surf. Sci. 79 (2005) 47-154. | [43] | F. Zhang, Y. Lian, M. Gu, J. Yu, T.B. Tang, J. Phys. Chem. C 121 (2017) 16006-16011. | [44] | B. Eifert, M. Becker, C.T. Reindl, M. Giar, L. Zheng, A. Polity, Y. He, C. Heiliger, P.J. Klar, Phys. Rev. Mater. 1 (2017) 14602. | [45] | P. Sarker, M.N. Huda, Comput. Mater. Sci. 111 (2016) 359-365. | [46] | P.C. Hsu, S.P. Tsai, C.H. Chang, C.J. Hsu, W.C. Chen, H.H. Hsieh, C.C. Wu, Thin Solid Films 585 (2015) 50-56. | [47] | J.P. Allen, D.O. Scanlon, L.F.J. Piper, G.W. Watson, J. Mater. Chem. C 1 (2013) 8194. | [48] | T. Kamiya, K. Nomura, H. Hosono, J. Disp. Technol. 5 (2009) 468-483. |
|