Brazing temperature-dependent interfacial reaction layer features between CBN and Cu-Sn-Ti active filler metal

doi:10.1016/j.jmst.2019.05.041

Abstract

Abstract:

CBN/Cu-Sn-Ti (CBN: cubic boron nitride) composites are prepared by active brazing sintering at 1123 K, 1173 K, 1223 K and 1273 K, respectively. The effects of brazing temperature on the wettability, interfacial characteristics, and elemental distribution variations are fully investigated. When the brazing temperature is below 1223 K, completely uncoated and/or partially coated CBN particles with sharp edges can still be observed, and the reaction layer, mainly composed of TiN and TiB2, appears to be thin and uneven. When the brazing temperature is 1223 K, all CBN particles are completely coated, suggesting that adequate wetting has taken place. Besides, as Ti diffuses thoroughly and enriches the interface, the reaction layer, filled primarily by TiN, TiB₂ and TiB, becomes thicker (about 1.30 μm), more uniform, stable and continuous. Further increasing the temperature to 1273 K is unnecessary or even harmful as the reaction layer thickness undergoes negligible change yet some tiny micro-cracks appear on the interface, which may likely deteriorate the grinding capability of the final brazing products.

Key words: Brazing temperature, CBN/Cu-Sn-Ti filler metal, Wettability, Reaction layer

Yonggang Fan, Junxiang Fan, Cong Wang. Brazing temperature-dependent interfacial reaction layer features between CBN and Cu-Sn-Ti active filler metal[J]. J. Mater. Sci. Technol., 2019, 35(10): 2163-2168.

Figures/Tables 4

Fig. 1. Wetting morphology of CBN grain brazed by Cu-Sn-Ti active filler metal at (a) raw CBN particles, (b) 1123 K, (c) 1173 K, (d) 1223 K and (e) 1273 K. Green dashed lines circle areas show completely uncoated CBN grains, red dashed lines circle represent regions partially coated, and yellow dashed lines show completely coated CBN particles.

Fig. 2. Typical microstructure and elemental mapping energy spectrum images and line scanning analysis of CBN/Cu-Sn-Ti composites at different brazing temperatures: (a) 1123 K; (b) magnified image of (a); (c) line scanning image of (b); (d) 1173 K; (e) magnified image of (d); (f) line scanning image of (e); (g) 1223 K; (h) magnified image of (g); (i) line scanning image of (h); (j) 1273 K; (k) magnified image of (j); (l) line scanning image of (k). Red, green, blue, cyan and magenta squares represent areas where the Ti, Cu, Sn, N, B exists, respectively. The distribution of red, green, blue, cyan and magenta lines represents the trend of Ti, Cu, Sn, N, B at different positions.

Fig. 3. XRD analyses of resultants of CBN/Cu-Sn-Ti active filler metal brazed at different temperatures: (a) 1123 K; (b) 1173 K; (c) 1223 K; (d) 1273 K.

Fig. 4. (a) TEM micrograph showing interface microstructure between CBN/Cu-Sn-Ti composites at 1223 K and (b, c, d) selected area diffraction patterns of layer 1, green and yellow dashed circle areas, respectively.

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