Hot deformation behavior of an antibacterial Co-29Cr-6Mo-1.8Cu alloy and its effect on mechanical property and corrosion resistance

doi:10.1016/j.jmst.2016.09.025

Abstract

Abstract:

In order to optimize the deformation processing, the hot deformation behavior of Co-Cr-Mo-Cu (hereafter named as Co-Cu) alloy was studied in this paper at a deformation temperature range of 950-1150 °C and a strain rate range of 0.008-5 s^-1. Based on the true stress-true strain curves, a constitutive equation in hyperbolic sin function was established and a hot processing map was drawn. It was found that the flow stress of the Co-Cu alloy increased with the increase of the strain rate and decreased with the increase of the deforming temperature. The hot processing map indicated that there were two unstable regions and one well-processing region. The microstructure, the hardness distribution and the electrochemical properties of the hot deformed sample were investigated in order to reveal the influence of the hot deformation. Microstructure observation indicated that the grain size increased with the increase of the deformation temperature but decreased with the increase of the strain rate. High temperature and low strain rate promoted the crystallization process but increased the grain size, which results in a reduction in the hardness. The hot deformation at high temperature (1100-1150 °C) would reduce the corrosion resistance slightly. The final optimized deformation process was: a deformation temperature from 1050to 1100 °C, and a strain rate from 0.008 to 0.2 s^-1, where a completely recrystallized and homogeneously distributed microstructure would be obtained.

Key words: Cu containing Co based alloy, Flow behaviors, Constitutive equation, Hot processing map, Recrystallization, Co-Cr-Mo alloy, Biomedical application

Erlin Zhang, Yang Ge, Gaowu Qin. Hot deformation behavior of an antibacterial Co-29Cr-6Mo-1.8Cu alloy and its effect on mechanical property and corrosion resistance[J]. J. Mater. Sci. Technol., 2018, 34(3): 523-533.

Figures/Tables 12

Fig. 1. True stress-true strain curves of Co-2Cu alloy at different strain rates and deformation temperatures (the experimental data, solid line; the predicted results, line + symbol): (a) 950 °C; (b) 1000 °C; (c) 1050 °C; (d) 1100 °C; (e) 1150 °C.

Fig. 2. Relationship during hot compression of Co-2Cu alloy: (a) lnε-lnσ; (b) lnε-σ; (c) lnε-ln[sinh(ασ)]; (d) ln[sinh(ασ)]-1/T.

Table 1 Polynomial parameter α, n, A and Q at different strain rates of Co-2Cu alloy.

ε	α(×10^-3)	n	A	Q
0.1	9.56	14.41	4.45E + 23	670.48
0.2	4.08	11.09	1.56E + 23	627.20
0.3	4.03	7.86	3.08E + 21	583.30
0.4	4.07	6.376	2.08E + 20	551.40
0.5	4.11	5.71	3.0E + 19	528.53
0.6	4.17	5.31	1.19E + 19	517.20
0.7	4.25	5.04	1.24E + 18	491.75
0.8	4.36	4.93	7.41E + 16	461.00
0.9	4.44	4.93	6.11E + 15	433.49
1	4.52	4.97	6.15E + 14	408.03

Fig. 3. Processing maps of Co-2Cu alloy at different strains: (a) ε = 0.6; (b) ε = 0.8; (c) ε = 1.

Fig. 4. XRD analysis of Co-2Cu alloy: (a) XRD diffraction patterns of Co-2Cu alloys under different conditions; (b) the distribution map of the weight fraction of hcp ε-phase after hot deformation.

Fig. 5. Microstructure of Co-2Cu alloy after hot deformation at a strain rate of 0.04 s-1 and at different temperatures. (a) 950 °C; (b) 1000 °C; (c) 1050 °C; (d) 1100 °C; (e) 1150 °C.

Fig. 6. Microstructure of Co-2Cu alloy after hot deformation at a strain rate of 0.008 s-1 and different temperatures: (a) 1000 °C; (b) 1050 °C; (c) 1100 °C; (d) 1150 °C.

Fig. 7. Microstructure of Co-2Cu alloy after hot deformation at 1100 and 1150 °C and different strain rates: (a) 1100 °C/0.2 s-1; (b) 1100 °C/1 s-1; (a) 1150 °C/0.2 s-1; (b) 1150 °C/1 s-1.

Fig. 8. Hardness (HRC) distribution of Co-2Cu alloys after hot deformation at different compressive parameters.

Fig. 9. Electrochemical curves of Co-2Cu alloys before and after the deformation at different compressive parameters: (a) open-circuit potential (OCP), (b) Tafel curves, (c) Bode and Bode phase plot diagram, (d) Nyquist plot diagram. (line + symbol in (c) and (d): calculated date from a simple equivalent circuit (RS(RpQ))).

Table 2 Electrochemical data obtained from OCP and Tafel curves.

Processing	E_ocp (mV)	E_corr (mV)	i_corr (nA/cm²)	V (mg/(cm²year))
1050 °C/0.008 s^-1	-154.6 ± 16.3	-178.2 ± 13.6	66.7 ± 13.4	0.64 ± 0.17
1050 °C/0.04 s^-1	-138.3 ± 21.6	-133.0 ± 15.4	63.0 ± 12.6	0.61 ± 0.15
1100 °C/0.008 s^-1	-156.7 ± 14.5	-158.3 ± 20.9	294.7 ± 25.9	2.84 ± 0.36
1100 °C/0.04 s^-1	-215.6 ± 23.5	-186.4 ± 16.7	401.9 ± 42.7	3.87 ± 0.46
1150 °C/0.008 s^-1	-128.5 ± 15.3	-176.0 ± 18.7	145.3 ± 20.1	1.40 ± 0.14
1150 °C/0.04 s^-1	-105.2 ± 9.9	-123.3 ± 13.6	212.7 ± 28.4	2.05 ± 0.21
Undeformed	-147.5 ± 17.7	-142.6 ± 18.5	119.5 ± 15.4	1.15 ± 0.15

Table 3 Equivalent circuit parameters for EIS spectra.

Processing	R_s (Ωcm²)	Q_b (μF/cm²)	n	R_p (kΩ cm²)
1050 °C/0.008 s^-1	28.51 ± 2.56	33.66 ± 1.84	0.90 ± 0.02	528 ± 52
1050 °C/0.04 s^-1	70.96 ± 3.68	14.05 ± 2.02	0.89 ± 0.02	829 ± 59
1100 °C/0.008 s^-1	32.78 ± 0.46	32.45 ± 0.88	0.91 ± 0.01	337 ± 29
1100 °C/0.04 s^-1	30.44 ± 1.25	26.53 ± 1.39	0.90 ± 0.01	211 ± 6
1150 °C/0.008 s^-1	28.93 ± 5.38	19.03 ± 3.67	0.79 ± 0.03	470 ± 63
1150 °C/0.04 s^-1	28.83 ± 2.43	6.80 ± 1.55	0.82 ± 0.01	390 ± 19
Undeformed	40.88 ± 1.46	37.11 ± 0.97	0.88 ± 0.01	468 ± 21

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