J Mater Sci Technol ›› 1999, Vol. 15 ›› Issue (02): 117-120.

• Research Articles • Previous Articles     Next Articles

Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

Huan LI, Jiabao LI, Zhongguang WANG, Chuanhai JIANG, Dezun WANG   

  1. State Key Laboratory for Fatigue and Fracture of Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, China ...
  • Received:1998-05-18 Revised:1998-06-29 Online:1999-03-28 Published:2009-10-10
  • Contact: Huan LI

Abstract: The thermal stress behavior of bonded SiC/6061AL laminates during thermal cycling and the stress relaxation at elevated temperature (205℃) were investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061Al layer took place during thermal cycling, and the same closed stress temperature loop was formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061Al layer at 205℃ within the range of 0.5-16 h, and which was nearly unchanged with further prolongation of time.

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