J. Mater. Sci. Technol. ›› 2018, Vol. 34 ›› Issue (8): 1305-1314.DOI: 10.1016/j.jmst.2017.11.046
• Orginal Article • Previous Articles Next Articles
Li-Yin Gaoab, Hao Zhangac, Cai-Fu Liac, Jingdong Guoa, Zhi-Quan Liuabc()
Received:
2017-02-21
Revised:
2017-04-22
Accepted:
2017-04-27
Online:
2018-08-17
Published:
2018-08-22
Li-Yin Gao, Hao Zhang, Cai-Fu Li, Jingdong Guo, Zhi-Quan Liu. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package[J]. J. Mater. Sci. Technol., 2018, 34(8): 1305-1314.
Fig. 2. The interfacial microstructures of different solder joints without EM test: (a) Cu, (b) Fe-73Ni, (c) Fe-45Ni after reflow; and (d) Cu, (e) Fe-73Ni, (f) Fe-45Ni after annealing at 150 °C for 1000 h.
Fig. 3. The interfacial microstructures of different solder joints after 300 h EM: (a) Cu, and enlarged images of (b) Cu cathode and (c) Cu anode; (d) Fe-73Ni, and enlarged images of (e) Fe-73Ni cathode and (f) Fe-73Ni anode; (g) Fe-45Ni, and enlarged images of (h) Fe-45Ni cathode and (i) Fe-45Ni anode.
Fig. 4. The interfacial microstructures of different solder joints after 1000 h EM: (a) Cu, and enlarged images of (b) Cu cathode and (c) Cu anode; (d) Fe-73Ni, and enlarged images of (e) Fe-73Ni cathode and (f) Fe-73Ni anode; (g) Fe-45Ni, and enlarged images of (h) Fe-45Ni cathode and (i) Fe-45Ni anode.
Elements (at.%) | |||||||
---|---|---|---|---|---|---|---|
IMC layers from UBM to solder | Cu | Ni | Fe | Sn | Results | ||
Fe-73Ni | First layer at both cathode and anode | 0-1.8 | 0-6.1 | 22.5-30.6 | 61.4-77.6 | FeSn2 | |
Second layer at both cathode and anode | 27.9-33.8 | 13.0-16.7 | 5.3-8.9 | 44.0-46.7 | FeSn2 +(Cu,Ni)6Sn5 | ||
Third layer | cathode | 39.8-50.3 | 9.0-12.0 | 0-1.1 | 40.8-47.1 | (Cu,Ni)6Sn5 | |
anode | 54.1-59.1 | 0 | 0 | 40.9-46.3 | Cu6Sn5 | ||
Fe-45Ni | First layer at both cathode and anode | 0 | 5.8 | 31.6 | 62.6 | FeSn2 | |
Second layer at anode | 29.1-38.7 | 8.4-11.1 | 9.5-14.3 | 43.4-45.9 | FeSn2 +(Cu,Ni)6Sn5 | ||
Third layer at anode | 50.9-54.8 | 0 | 0 | 45.2-49.1 | Cu6Sn5 |
Table 1 Constituent of the IMC layers after 1000 h EM.
Elements (at.%) | |||||||
---|---|---|---|---|---|---|---|
IMC layers from UBM to solder | Cu | Ni | Fe | Sn | Results | ||
Fe-73Ni | First layer at both cathode and anode | 0-1.8 | 0-6.1 | 22.5-30.6 | 61.4-77.6 | FeSn2 | |
Second layer at both cathode and anode | 27.9-33.8 | 13.0-16.7 | 5.3-8.9 | 44.0-46.7 | FeSn2 +(Cu,Ni)6Sn5 | ||
Third layer | cathode | 39.8-50.3 | 9.0-12.0 | 0-1.1 | 40.8-47.1 | (Cu,Ni)6Sn5 | |
anode | 54.1-59.1 | 0 | 0 | 40.9-46.3 | Cu6Sn5 | ||
Fe-45Ni | First layer at both cathode and anode | 0 | 5.8 | 31.6 | 62.6 | FeSn2 | |
Second layer at anode | 29.1-38.7 | 8.4-11.1 | 9.5-14.3 | 43.4-45.9 | FeSn2 +(Cu,Ni)6Sn5 | ||
Third layer at anode | 50.9-54.8 | 0 | 0 | 45.2-49.1 | Cu6Sn5 |
Fig. 5. EDS mapping results: (a) Fe-73Ni cathode with (b) Fe, (c) Cu, (d) Ni and (e) Sn maps at Fe-73Ni cathode, respectively; (f) Fe-73Ni anode with (g) Fe, (h) Cu, (i) Ni and (j) Sn maps at Fe-73Ni anode, respectively.
Fig. 6. Failure modes for Fe-Ni solder joints under EM test: (a) Fe-73Ni in Mode I failed after 1649 h EM test and its enlarged images of (b) cathode and (c) anode; (d)Fe-73Ni in Mode II failed after 2213 h EM test and its enlarged images of (e) cathode and (f) anode; (g) Fe-45Ni in Mode I failed after 2749 h EM test and its enlarged images of (h) cathode and (i) anode.
UBM | Rho | β | η (h) |
---|---|---|---|
Cu | 0.98 | 2.1 | 698 |
Fe-73Ni | 0.98 | 4.0 | 2121 |
Fe-45Ni | 0.96 | 3.6 | 2340 |
Table 2 Parameters for Weibull distribution.
UBM | Rho | β | η (h) |
---|---|---|---|
Cu | 0.98 | 2.1 | 698 |
Fe-73Ni | 0.98 | 4.0 | 2121 |
Fe-45Ni | 0.96 | 3.6 | 2340 |
Atoms | Diffusivity (cm2/s) | ||
---|---|---|---|
Equations in literature | Single crystal (150 °C) | Polycrystalline (150 °C) | |
Cu [ | D∥ = 1.0 × 10-3exp(-16.80(kJ/mol)/RT) | 8.4 × 10-6 | 9.4 × 10-8 |
D⊥ = 2.4 × 10-3exp(-33.18(kJ/mol)/RT) | 1.9 × 10-7 | ||
Ni [ | D∥ = 1.99 × 10-2exp(-18.06(kJ/mol)/RT) | 1.2 × 10-4 | 1.9 × 10-9 |
D⊥ = 1.87 × 10-2exp(-54.09(kJ/mol)/RT) | 3.9 × 10-9 | ||
Fe [ | D = 4.8 × 10-4exp(-52.75(kJ/mol)/RT) | - | 2.4 × 10-10 |
Table 3 Diffusivities D of Cu, Ni and Fe within Sn.
Atoms | Diffusivity (cm2/s) | ||
---|---|---|---|
Equations in literature | Single crystal (150 °C) | Polycrystalline (150 °C) | |
Cu [ | D∥ = 1.0 × 10-3exp(-16.80(kJ/mol)/RT) | 8.4 × 10-6 | 9.4 × 10-8 |
D⊥ = 2.4 × 10-3exp(-33.18(kJ/mol)/RT) | 1.9 × 10-7 | ||
Ni [ | D∥ = 1.99 × 10-2exp(-18.06(kJ/mol)/RT) | 1.2 × 10-4 | 1.9 × 10-9 |
D⊥ = 1.87 × 10-2exp(-54.09(kJ/mol)/RT) | 3.9 × 10-9 | ||
Fe [ | D = 4.8 × 10-4exp(-52.75(kJ/mol)/RT) | - | 2.4 × 10-10 |
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